RheoPad Keeps your MacBook and Nintendo Switch from Overheating

Device overheating remains to be one of the most critical issues in our modern electronic gadgets. Mobile device manufacturers (e.g. OEM, IDM) have been looking for ways to effectively remove the heat generated within the devices due to high-speed and resource-intensive computing using conventionally known approaches such as a) vapor chamber, b) heat pipe, c) heat sink, and d) high-thermally conductive materials (e.g. Graphene) that attempt to conduct the heat to the edge/surface of the device. However, the effectiveness of these approaches is limited since these devices eventually reach thermal saturation after ~20 minutes of intensive and exhaustive usage, resulting in device overheating. As the devices continue to operate under such mission-critical conditions, the surface temperature these devices can further reach above 40 degC (with internal temperature of the device >100 degC), giving rise to accelerated aging of the chips, electronic components, and battery in these devices. Worst yet, mishaps due to lithium-ion battery fires and explosions can happen.

RheoPad, based on our proprietary dual-mode passive cooling technology, is designed to work seamlessly with mobile devices such as mobile phones, laptops, tablet PCs, game consoles, etc. Under passive liquid-cooling mode, the effectiveness of our RheoPad is further enhanced that can remove the heat within the devices more quickly and maintain a stable temperature at ~32 degC even when the devices are running apps that require high computational resources and power. The effective passive cooling technology provides unprecedented thermal dissipation performance while extending the battery life and endurance by >20%, compared to the other conventional approaches and existing solutions.